WHY THERMAL INTERFACE MATERIALS IS CONSIDERED AS THE BEST ALTERNATIVE TO ENHANCE THE PERFORMANCE OF ELECTRONIC PRODUCTS?

In today's world, a device must work at a very high speed while delivering smooth and efficient performance. For achieving this goal, engineers are working toward enhancing the computational power of the devices in more compact sizes, thus generating more heat. Overheating is one of the critical and significant concerns for next-generation electronics components and devices. and is one of the fundamental causes of electronic failure, and for dealing with this issue, companies are developing thermal management solutions. Thermal interface materials are the core for thermal management in electronics devices. With advancement in technology and the introduction of 5G technology, the demand for thermal management materials is expected to rise significantly. The 5G devices are embedded with high-power operating central processing units (CPUs), graphic processing units (GPUs), system on chips (SoCs), and memory units, which are the primary cause of thermal heat radiation in any device.

With the advent of 5G technology, a sufficient number of base stations are deployed in any area. These 5G base station units also generate significant demand for thermal management solutions. Radio units, baseband units, servers, and routers are the key locations that require constant monitoring of thermal management and uses thermal interface materials such as phase change materials, thermal pads, and thermal gels between heat sinks and heat radiating radio frequency (RF) and power components. Various unicorn companies of the 5G ecosystem are working on conducting research and development for 5G-enabled antennas to cater to the growing demand for 5G infrastructure across the globe. Some of the key market players are Huawei Technologies Co., Ltd., Samsung Electronics Co., Ltd., Nokia Corporation, and Ericsson. These companies' dominance differs from region to region, depending on their collaborative contracts with countries’ telecom operators. Some of the active telecom operators successfully achieving 5G infrastructure in the countries are Verizon, Vodafone, China Telecom, China Unicom, LG U+, AT&T, and KDDI.

Governments of various nations are strengthening the push toward developing 5G equipment and infrastructure to lead in the 5G race. Organizations are researching and developing new technologies that can achieve a breakthrough in the 5G industry. The 5G equipment manufacturers ecosystem has many budding players, thriving toward achieving new antenna technologies and products in the market. The Horizon 2020 work program promotes innovation of 5G networks in Europe, China, the U.S., and Taiwan, including cross-border connected and automated mobility while conducting 5G trials across different vertical industries. Asia-Pacific and Japan (APJ) countries also have significant telecom players, such as SK Telecom, China Unicom, SoftBank, LG U+, and Optus. These companies collaborate with 5G equipment manufacturers and suppliers, such as Ericsson, Huawei, and Nokia, to deploy 5G base stations. The MIMO technology accelerates the performance of a 5G infrastructure, enhancing the unit's overall efficiency. The shift toward 5G technology also affects the business development and simultaneously ramp up the demand for new thermal interface materials with high thermal conductivity, low thermal resistance, and low dielectric constant.

The competitive landscape of the global thermal interface materials market consists of different strategies undertaken by key players across the thermal interface materials industry to gain traction and market share presence. Some strategies adopted by thermal interface materials manufacturers are new product launches, business expansions, mergers, partnerships, and collaborations.

Among all these strategies adopted, product launches have led to the popular choice of the strategy implemented in the thermal interface materials market's competitive landscape. Some of the most prominent ecosystem players are Parker Hannifin Corp, Laird Technologies, Inc., and Henkel Corporation. For instance, In July 2020, Dow launched a thermally conductive gel for sensitive electronic components targeting 5G technology, called DOWSIL TC-3065 thermal gel. This gel can be used for ethernet switches, optical transceivers, and routers. In September 2020, Parker Hannifin Corp launched a new thermal interface material called THERM-A-GAPTM GEL 37, especially for 5G telecom infrastructure equipment and the automotive in-cabin market at a very competitive price point. The global thermal interface materials market accounted for $434.5 million in terms of value in 2020 and is expected to reach $908.9 million by 2026. The market is anticipated to grow at a CAGR of 14.36% during the forecast period 2021-2026. The Asia-Pacific and Japan region is expected to grow at a significant growth rate of 16.17% during the forecast period 2021-2026.

Key Questions Answered in this Report:

• What are the underlying structures resulting in the emerging trends within the global thermal interface materials market for 5G market?

• How are global material manufacturers and other players entering the market?

• What are the views of CXOs and senior management of the thermal interface materials companies operating in the space?

• Which thermal interface material for 5G is expected to be leading the market by 2026?

• What were the market values, and pricing of the leading segments and subsegments of the market in 2020, and how is the market estimated to grow during the forecast period?

• How is the industry expected to evolve during the forecast period 2021-2026?

• How is the industry impacted by the COVID-19?

• What are the key patents filled by the companies?

• What are the key strategies that have been implemented by the key players to sustain in the competitive market?

• The scope of this report has been focused on applications such as 5G smartphones, 5G base stations, servers, and routers, by product (thermal pads, thermal greases, thermal gels, thermal taps, thermal gap fillers, phase change materials, and graphite sheets, among others).

• The market value has been calculated based on the price of thermal interface materials used in a device.

• The base currency considered for the market analysis is US$. Currencies other than the US$ have been converted to the US$ for all statistical calculations, considering the average conversion rate for that particular year.

• The currency conversion rate has been taken from the historical exchange rate of the Oanda website.

• Nearly all the recent developments, from January 2018 to December 2020, have been taken into account in this research study.

• The information rendered in the report is a result of in-depth primary interviews, surveys, and secondary analysis.

• Where relevant information was not available, proxy indicators and extrapolation have been employed.

• Any economic downturn in the future has not been taken into consideration for the market estimation and forecast.

• Technologies currently used are expected to persist through the forecast with no breakthroughs in technology.

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